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STM32F407IG Datasheet(PDF) 59 Page - STMicroelectronics

Part # STM32F407IG
Description  USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera
PDF  154 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F407IG Datasheet(HTML) 59 Page - STMicroelectronics

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STM32F405xx, STM32F407xx
Electrical characteristics
Doc ID 022152 Rev 1
59/154
VBAT
Backup operating voltage
1.65
3.6
V
VCAP1
When the internal regulator is ON,
VCAP_1 and VCAP_2 pins are used to
connect a stabilization capacitor.
When the internal regulator is OFF
(BYPASS_REG connected to VDD),
VCAP_1 and VCAP_2 must be supplied
from 1.2 V.
1.1
1.3
V
VCAP2
PD
Power dissipation at TA = 85 °C for
suffix 6 or TA = 105 °C for suffix 7
(6)
LQFP64
-
TBD
mW
LQFP100
-
TBD
LQFP144
-
TBD
LQFP176
-
TBD
UFBGA176
-
TBD
TA
Ambient temperature for 6 suffix
version
Maximum power dissipation
–40
85
°C
Low power dissipation(7)
–40
105
Ambient temperature for 7 suffix
version
Maximum power dissipation
–40
105
°C
Low power dissipation(7)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
1.
TBD stands for “to be defined”.
2.
If PDR_ON is set to VSS, this value can be lowered to 1.7 V when the device operates in a reduced temperature range (0 to
70 °C).
3.
When the ADC is used, refer to Table 64: ADC characteristics.
4.
If VREF+ pin is present, it must respect the following condition: VDDA-VREF+ < 1.2 V.
5.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and
VDDA can be tolerated during power-up and power-down operation.
6.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
7.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
Table 10.
General operating conditions(1) (continued)
Symbol
Parameter
Conditions
Min
Max
Unit



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