Reliability

VI qualification includes aging at various extreme temperatures, shock and vibration, temperature cycling, and IR reflow

simulation. The VC-501 family is capable of meeting the following qualification tests:

Table 6. Environmental Compliance

Parameter

Conditions

Mechanical Shock

MIL-STD-883, Method 2002

Mechanical Vibration

MIL-STD-883, Method 2007

Solderability

MIL-STD-883, Method 2003

Gross and Fine Leak

MIL-STD-883, Method 1014

Resistance to Solvents

MIL-STD-883, Method 2015

Moisture Sensitivity Level

MSL 1

Contact Pads

Gold over Nickel

Handling Precautions

Table 7. ESD Ratings

Model

Minimum

Conditions

Human Body Model

500V

MIL-STD-883, Method 3015

Charged Device Model

500V

JESD22-C101

Table 8. Reflow Profile

Parameter

Symbol

Value

PreHeat Time

Ts-min

Ts-max

t

S

60 sec Min, 180 sec Max

150°C

200°C

Ramp Up

R

UP

3 °C/sec Max

Time Above 217 °C

t

L

60 sec Min, 150 sec Max

Time To Peak Temperature

T

AMB-P

480 sec Max

Time at 260 °C

t

P

20 sec Min, 40 sec Max

Ramp Down

R

DN

6 °C/sec Max

Although ESD protection circuitry has been designed into the VC-501 proper precautions should be taken when handling and

mounting. VI employs a human body model (HBM) and a charged device model (CDM) for ESD susceptibility testing and design

protection evaluation.

The device is qualified to meet the JEDEC

standard for Pb-Free assembly. The

temperatures and time intervals listed are based

on the Pb-Free small body requirements. The

VC-501 device is hermetically sealed so an

aqueous wash is not an issue.

Termination Plating:

Electroless Gold Plate over Nickel Plate

Figure 8. Recommended Reflow Profile

Page8

Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com

Rev: 6/30/2011