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MICRF506 Datasheet(PDF) 31 Page - Micrel Semiconductor |
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MICRF506 Datasheet(HTML) 31 Page - Micrel Semiconductor |
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31 / 42 page ![]() Micrel MICRF506BML/YML MICRF506BML/YML Land pattern Figure below shows recommended land pattern. Red circles indicate Thermal/RFGND via’s. Recommended size is 0.300-0.350mm with a pitch of 1mm. The recommended minimum number of via’s are 9 and they should be directly connected to ground plane providing the best RF ground and thermal performance. For best yield plugged or open via’s should be used. D2' Y e X E2' SD SE d D2’ E2’ SD SE d e X Y Units 3.4 ±0.02 3.4 ±0.02 4.2 ±0.05 4.2 ±0.05 0.325 ±0.25 0.5 0.23 ±0.02 0.5 ±0.02 mm Red circle indicates Thermal Via. Size 0.300-0.350mm July 2006 31 M9999-092904 +1 408-944-0800 |
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