RT9595

3

DS9595-04

March 2012

www.richtek.com

©

Copyright

2012 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

Pin N o.

Pin N ame

Pin Function

1,

11 (Exposed Pad)

GND

Ground. The exposed pad must be soldered to a large PCB and connected to

GND for maximum power dissipation.

2

DRVOUT

IGBT Driver Output Pin.

3

VDD

Power Input Pin.

4

DRVIN

IGBT Driver Input Pin.

5

CH ARGE

Charge Enable Pin. The charge function is executed w hen CHAR GE pin is

set from Low to High. The chip is in Shutdown mode when CHARGE pin is

set to Low .

6

STAT

Charge Status Output. Open Drain output. When target output voltage is

reached, N-MOSFET turns on. This pin needs a pull up resistor.

7

FB

Feedback Voltage Pin.

8

CS

Input C urrent Setting Pin.

9

NC

No Internal C onnection.

10

SW

N-MOSFET Switching Node.

Functional Pin Description

Recommended Operating Conditions

(Note 4)

Drain Source Voltage ----------------------------------------------------------------------------------------------------- 40V

Junction Temperature Range --------------------------------------------------------------------------------------------

−40°C to 125°C

Ambient Temperature Range --------------------------------------------------------------------------------------------

−40°C to 85°C

Absolute Maximum Ratings

(Note 1)

Built-in N-Channel Enhancement MOSFET

Drain-Source Voltage ----------------------------------------------------------------------------------------------------- 45V

CS, CHARGE, DRVIN, DRVOUT, STAT, FB ------------------------------------------------------------------------- 6V

SW Pulse Current (Pulse Width

1

μs) ----------------------------------------------------------------------------- 4A

SW Continuous Current ------------------------------------------------------------------------------------------------- 2A

°C

WDFN-10L 3x3 ------------------------------------------------------------------------------------------------------------- 1.667W

Package Thermal Resistance (Note 2)

WDFN-10L 3x3,

WDFN-10L 3x3,

Junction Temperature ----------------------------------------------------------------------------------------------------- 150

°C

Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260

°C

Storage Temperature Range --------------------------------------------------------------------------------------------

ESD Susceptibility (Note 3)

HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV

MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V

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