9

Maxim Integrated

MAX44281

Ultra-Small, Ultra-Thin, 4-Bump Op Amp

Typical Application Circuit

WLP Applications Information

For the latest application details on WLP construction,

dimensions, tape carrier information, PCB techniques,

bump-pad layout, and recommended reflow temperature

profile, as well as the latest information on reliability test-

ing results, refer to Application Note 1891: Wafer-Level

Packaging (WLP) and Its Applications.

Ordering Information

Package Information

For the latest package outline information and land patterns (foot-

prints), go to www.maximintegrated.com/packages. Note that a

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but the

drawing pertains to the package regardless of RoHS status.

+Denotes a lead(Pb)-free/RoHS-compliant package.

*Future product—contact factory for availability.

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

4 WLP

N40A0-1

21-0612

Refer to

Application

Note 1891

PART

TEMP

RANGE

PIN-

PACKAGE

FUNCTION

MAX44281OANS+T*

-40NC to

+125NC

4 WLP

Noninverting,

MAX44281VANS+T

-40NC to

+125NC

4 WLP

Noninverting,

MAX44281UANS+T

-40NC to

+125NC

4 WLP

Noninverting,

22kI

10kI

2.4kI

ADC

MAX11645

3.3nF

MAX44281

+5V

330pF

SALLEN-KEY FILTER

CORNER FREQUENCY = 10kHz

15nF