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AD7723 Datasheet(PDF) 22 Page - Analog Devices |
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AD7723 Datasheet(HTML) 22 Page - Analog Devices |
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22 / 23 page ![]() AD7723 –22– REV. 0 GROUNDING AND LAYOUT The analog and digital power supplies to the AD7723 are inde- pendent and separately pinned out to minimize coupling be- tween analog and digital sections within the device. All the AD7723 AGND and DGND pins should be soldered directly to a ground plane to minimize series inductance. In addition, the ac path from any supply pin or reference pin (REF1 and REF2) through its decoupling capacitors to its associated ground must be made as short as possible (Figure 44). To achieve the best decou- pling, place surface mount capacitors as close as possible to the device, ideally right up against the device pins. All ground planes must not overlap to avoid capacitive coupling. The AD7723’s digital and analog ground planes must be con- nected at one place by a low inductance path, preferably right under the device. Typically, this connection will either be a trace on the Printed Circuit Board of 0.5 cm wide when the ground planes are on the same layer, or 0.5 cm wide minimum plated through holes when the ground planes are on different layers. Any external logic connected to the AD7723 should use a ground plane separate from the AD7723’s digital ground plane. These two digital ground planes should also be con- nected at just one place. Separate power supplies for AVDD and DVDD are also highly desirable. The digital supply pin DVDD should be powered from a separate analog supply, but if necessary DVDD may share its power connection to AVDD. Refer to the connection diagram (Figure 44). The ferrites are also recommended to filter high frequency signals from corrupting the analog power supply. A minimum etch technique is generally best for ground planes as it gives the best shielding. Noise can be minimized by paying attention to the system layout and preventing different signals from interfering with each other. High level analog signals should be separated from low level analog signals, and both should be kept away from digital signals. In waveform sampling and reconstruction systems the sampling clock (CLKIN) is as vulnerable to noise as any analog signal. CLKIN should be isolated from the analog and digital systems. Fast switching signals like clocks should be shielded with their associated ground to avoid radiating noise to other sections of the board, and clock signals should never be routed near the analog inputs. Avoid running digital lines under the device as these will couple noise onto the die. The analog ground plane should be allowed to run under the AD7723 to shield it from noise coupling. The power supply lines to the AD7723 should use as large a trace as possible (preferably a plane) to provide a low impedance path and reduce the effects of glitches on the power supply line. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This will reduce the effects of feedthrough through the board. +5V 10 F 100nF 100nF 100nF 10nF 10nF 10nF 10nF 10nF 10 F 220nF 10nF 1 F REF2 AGND2 REF1 AVDD1 AGND1 AGND1 AGND AGND AVDD AVDD DVDD DGND DGND AD7723 ANALOG GROUND PLANE AD7723 DIGITAL GROUND PLANE Figure 44. Reference and Power Supply Decoupling |
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