REV. 0

–3–

AD8018

Parameter

Conditions

Min

Typ

Max

Unit

LOGIC INPUTS (PWDN1, 0)

Logic “1” Voltage

2.0

V

Logic “0” Voltage

0.8

V

Logic Input Bias Current

240

A

Standby Recovery Time

Ω, G = +2, I

500

ns

Specifications subject to change without notice.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8018AR

–40

°C to +85°C 8-Lead Plastic

SO-8

SOIC

AD8018AR–REEL

–40

°C to +85°C 8-Lead SOIC

SO-8

AD8018ARU

–40

°C to +85°C 14-Lead Plastic RU-14

TSSOP

AD8018ARU–REEL –40

°C to +85°C 14-Lead Plastic RU-14

TSSOP

AD8018ARU–EVAL

Evaluation Board RU-14

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V

Internal Power Dissipation

2

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . 650 mW

TSSOP Package (RU) . . . . . . . . . . . . . . . . . . . . . . 565 mW

Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . .

Logic Voltage, PWDN0, 1 . . . . . . . . . . . . . . . . . . . . . . . . .

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .

±1.6 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range RU, R . . . . . . . –65

°C to +125°C

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead SOIC Package:

θ

°C/W.

8-Lead TSSOP Package:

θ

°C/W.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8018

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150

°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change

in the stresses exerted on the die by the package. Exceeding a

junction temperature of 175

°C for an extended period can result

in device failure.

While the AD8018 is internally short circuit protected, this may

not be sufficient to guarantee that the maximum junction tempera-

ture (150

°C) is not exceeded under all conditions. To ensure

proper operation, it is necessary to observe the maximum power

derating curves.

AMBIENT TEMPERATURE – C

2.0

–50

1.5

1.0

0.5

0

–40 –30 –20 –10 0

10

2030

4050

60 70

80 90

14-LEAD TSSOP PACKAGE

8-LEAD SOIC PACKAGE

Figure 3. Plot of Maximum Power Dissipation vs.

Temperature

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8018 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE