ADF4159 datasheet(6/36 Pages) AD

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ADF4159

Data Sheet

Rev. B | Page 6 of 36

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, GND = AGND = DGND = SDGND = CPGND =

0 V, unless otherwise noted.

Table 4.

Parameter

Rating

AVDD to GND

−0.3 V to +3.9 V

DVDD to GND

−0.3 V to +2.4 V

VP to GND

−0.3 V to +3.9 V

VP to AVDD

−0.3 V to +0.3 V

Digital I/O Voltage to GND

−0.3 V to DVDD + 0.3 V

Analog I/O Voltage to GND

−0.3 V to AVDD + 0.3 V

REFIN to GND

−0.3 V to DVDD + 0.3 V

RFIN to GND

−0.3 V to AVDD + 0.3 V

Operating Temperature Range,

Industrial

−40°C to +125°C

Storage Temperature Range

−65°C to +125°C

Maximum Junction Temperature

150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

40 sec

ESD

Charged Device Model

1000 V

Human Body Model

3000 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Thermal impedance (θJA) is specified for a device with the

exposed pad soldered to AGND.

Table 5. Thermal Resistance

Package Type

θJA

Unit

24-Lead LFCSP_WQ

30.4

°C/W

ESD CAUTION

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