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OPA2180 Datasheet(PDF) 4 Page - Texas Instruments

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Part # OPA2180
Description  0.1-關V/째C Drift, Low-Noise, Rail-to-Rail Output, 36-V, Zero-Drift OPERATIONAL AMPLIFIERS
PDF  27 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OPA2180 Datasheet(HTML) 4 Page - Texas Instruments

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OPA2180
OPA4180
SBOS584C – NOVEMBER 2011 – REVISED DECEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = ±2 V to ±18 V (VS = +4 V to +36 V) (continued)
At TA = +25°C, RL = 10 kΩ connected to VS/2, and VCOM = VOUT = VS/2, unless otherwise noted.
OPA2180, OPA4180
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
No load
8
18
mV
Voltage output swing from rail
RL = 10 kΩ
250
300
mV
TA = –40°C to +105°C, RL = 10 kΩ
325
360
mV
ISC
Short-circuit current
±18
mA
RO
Open-loop output resistance
f = 2 MHz, IO = 0 mA
120
Ω
CLOAD
Capacitive load drive
1
nF
POWER SUPPLY
VS
Operating voltage range
±2 (or 4)
±18 (or 36)
V
450
525
μA
IQ
Quiescent current (per amplifier)
TA = –40°C to +105°C, IO = 0 mA
600
μA
TEMPERATURE
Specified range
–40
+105
°C
Operating range
–40
+125
°C
Storage range
–65
+150
°C
THERMAL INFORMATION: OPA2180
OPA2180
THERMAL METRIC(1)
D (SO)
DGK (MSOP)
UNITS
8 PINS
8 PINS
θJA
Junction-to-ambient thermal resistance
111.0
159.3
θJCtop
Junction-to-case (top) thermal resistance
54.9
37.4
θJB
Junction-to-board thermal resistance
51.7
48.5
°C/W
ψJT
Junction-to-top characterization parameter
9.3
1.2
ψJB
Junction-to-board characterization parameter
51.1
77.1
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4180
OPA4180
THERMAL METRIC(1)
D (SO)
PW (TSSOP)
UNITS
14 PINS
14 PINS
θJA
Junction-to-ambient thermal resistance
93.2
106.9
θJCtop
Junction-to-case (top) thermal resistance
51.8
24.4
θJB
Junction-to-board thermal resistance
49.4
59.3
°C/W
ψJT
Junction-to-top characterization parameter
13.5
0.6
ψJB
Junction-to-board characterization parameter
42.2
54.3
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Links: OPA2180 OPA4180



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