THS7376IPWR datasheet(2/61 Pages) TI

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THS7376

SBOS692 – JUNE 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

Supply, VS+ to GND

5.5

Voltage

Input, VI

–0.4 to VS+

Continuous Output current, IO

±75

Continuous power dissipation

See Thermal Information Table

Maximum junction, any condition(2), TJ

+150

°C

Maximum junction, continuous

Temperature

+125

°C

operation, long-term reliability(3), TJ

Storage range, Tstg

–60 to +150

°C

Human body model (HBM)

±10

Electrostatic discharge (ESD) ratings

(output pins)

Charge device model (CDM)

±2

Human body model (HBM)

±8

Electrostatic discharge (ESD) ratings

(all other pins)

Charge device model (CDM)

±1

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(3)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and lifetime of the device.

THERMAL INFORMATION

THS7376

THERMAL METRIC(1)

PW (TSSOP)

UNITS

14 PINS

θJA

Junction-to-ambient thermal resistance

124.2

θJCtop

Junction-to-case (top) thermal resistance

52.9

θJB

Junction-to-board thermal resistance

66.0

°C/W

ψJT

Junction-to-top characterization parameter

7.3

ψJB

Junction-to-board characterization parameter

65.4

θJCbot

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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