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LPC81XM Datasheet(PDF) 57 Page - NXP Semiconductors

Part # LPC81XM
Description  32-bit ARM Cortex-M0 microcontroller; up to 16 kB flash and 4 kB SRAM
PDF  71 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC81XM Datasheet(HTML) 57 Page - NXP Semiconductors

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LPC81xM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 3 — 29 July 2013
57 of 71
NXP Semiconductors
LPC81xM
32-bit ARM Cortex-M0+ microcontroller
14.2 XTAL Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1,Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
Fig 35. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 24.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
1 MHz - 5 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 300
39 pF, 39 pF
30 pF
< 300
57 pF, 57 pF
5 MHz - 10 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 200
39 pF, 39 pF
30 pF
< 100
57 pF, 57 pF
10 MHz - 15 MHz
10 pF
< 160
18 pF, 18 pF
20 pF
< 60
39 pF, 39 pF
15 MHz - 20 MHz
10 pF
< 80
18 pF, 18 pF
Table 25.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz - 20 MHz
10 pF
< 180
18 pF, 18 pF
20 pF
< 100
39 pF, 39 pF
20 MHz - 25 MHz
10 pF
< 160
18 pF, 18 pF
20 pF
< 80
39 pF, 39 pF



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