TPS65137

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SLVS929A – MAY 2010 – REVISED OCTOBER 2012

THERMAL INFORMATION

TPS65137

DSC

UNITS

10

56.5

65.8

25.2

°C/W

1.0

17.9

2.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

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RECOMMENDED OPERATING CONDITIONS

(1)

MIN

NOM

MAX

UNIT

Input voltage range

2.3

5.5

V

Operating ambient temperature

–40

+85

°C

Operating junction temperature

–40

+125

°C

(1)

Refer to application section for further information.

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