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LPC2364 Datasheet(PDF) 17 Page - NXP Semiconductors |
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LPC2364 Datasheet(HTML) 17 Page - NXP Semiconductors |
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17 / 69 page ![]() LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 17 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers [1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. [2] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input, digital section of the pad is disabled. [3] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. [4] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [5] Pad provides digital I/O and USB functions (LPC2364/66/68 only). It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). [6] 5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. [7] This pin has no built-in pull-up and no built-in pull-down resistor. [8] This pin has a built-in pull-up resistor. [9] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. [10] Pad provides special analog functionality. [11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTAL2 should be left floating. RSTOUT 14 - O RSTOUT — This is a 3.3 V pin. LOW on this pin indicates LPC2364/65/66/67/68 being in Reset state. Note: This pin is available in LPC2364FBD100, LPC2365FBD100, LPC2366FBD100, LPC2367FBD100, and LPC2368FBD100 devices only (LQFP100 package). RESET 17[9] F3[9] I External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. XTAL1 22[10][11] H2[10][11] I Input to the oscillator circuit and internal clock generator circuits. XTAL2 23[10][11] G3[10][11] O Output from the oscillator amplifier. RTCX1 16[10][12] F2[10][12] I Input to the RTC oscillator circuit. RTCX2 18[10] G1[10] O Output from the RTC oscillator circuit. VSS 15, 31, 41, 55, 72, 97, 83[13] B3, B7, C9, F1, G7, J6, K3 [13] I ground: 0 V reference. VSSA 11[14] E1[14] I analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. VDD(3V3) 28, 54, 71, 96[15] A3, C10, H9, K2[15] I 3.3 V supply voltage: This is the power supply voltage for the I/O ports. VDD(DCDC)(3V3) 13, 42, 84[16] A7, E4, H6[16] I 3.3 V DC-to-DC converter supply voltage: This is the supply voltage for the on-chip DC-to-DC converter only. VDDA 10[17] E2[17] I analog 3.3 V pad supply voltage: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. VREF 12[17] E3[17] I ADC reference: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC and DAC. VBAT 19[17] G2[17] I RTC pin power supply: 3.3 V on this pin supplies the power to the RTC peripheral. Table 4. Pin description …continued Symbol Pin Ball Type Description |
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