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LPC2364 Datasheet(PDF) 17 Page - NXP Semiconductors

Part # LPC2364
Description  Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
PDF  69 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC2364 Datasheet(HTML) 17 Page - NXP Semiconductors

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LPC2364_65_66_67_68
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7.1 — 16 October 2013
17 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide
output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
[5]
Pad provides digital I/O and USB functions (LPC2364/66/68 only). It is designed in accordance with the USB specification, revision 2.0
(Full-speed and Low-speed mode only).
[6]
5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
This pin has no built-in pull-up and no built-in pull-down resistor.
[8]
This pin has a built-in pull-up resistor.
[9]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[10] Pad provides special analog functionality.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
RSTOUT
14
-
O
RSTOUT — This is a 3.3 V pin. LOW on this pin indicates
LPC2364/65/66/67/68 being in Reset state.
Note: This pin is available in LPC2364FBD100, LPC2365FBD100,
LPC2366FBD100, LPC2367FBD100, and LPC2368FBD100 devices only
(LQFP100 package).
RESET
17[9]
F3[9]
I
External reset input: A LOW on this pin resets the device, causing I/O
ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
22[10][11]
H2[10][11] I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
23[10][11]
G3[10][11] O
Output from the oscillator amplifier.
RTCX1
16[10][12]
F2[10][12] I
Input to the RTC oscillator circuit.
RTCX2
18[10]
G1[10]
O
Output from the RTC oscillator circuit.
VSS
15, 31,
41, 55,
72, 97,
83[13]
B3, B7,
C9, F1,
G7, J6,
K3 [13]
I
ground: 0 V reference.
VSSA
11[14]
E1[14]
I
analog ground: 0 V reference. This should nominally be the same voltage
as VSS, but should be isolated to minimize noise and error.
VDD(3V3)
28, 54,
71,
96[15]
A3, C10,
H9,
K2[15]
I
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(DCDC)(3V3)
13, 42,
84[16]
A7, E4,
H6[16]
I
3.3 V DC-to-DC converter supply voltage: This is the supply voltage for
the on-chip DC-to-DC converter only.
VDDA
10[17]
E2[17]
I
analog 3.3 V pad supply voltage: This should be nominally the same
voltage as VDD(3V3) but should be isolated to minimize noise and error. This
voltage is used to power the ADC and DAC.
VREF
12[17]
E3[17]
I
ADC reference: This should be nominally the same voltage as VDD(3V3) but
should be isolated to minimize noise and error. Level on this pin is used as
a reference for ADC and DAC.
VBAT
19[17]
G2[17]
I
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description



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