LPC2364 datasheet(64/69 Pages) NXP

64 / 69 page

LPC2364_65_66_67_68

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Product data sheet

Rev. 7.1 — 16 October 2013

64 of 69

NXP Semiconductors

LPC2364/65/66/67/68

Single-chip 16-bit/32-bit microcontrollers

17. Revision history

Table 20.

Revision history

Document ID

Release date

Data sheet status

Change

notice

Supersedes

LPC2364_65_66_67_68 v.7.1

20131016

Product data sheet

LPC2364_65_66_67_68 v.7

Modifications:

• Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.

• Table 9 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.

LPC2364_65_66_67_68 v.7

20111020

Product data sheet

LPC2364_65_66_67_68 v.6

Modifications:

• Table 13 “Dynamic characteristics of flash”: Added characteristics for ter and tprog.

• Table 4 “Pin description”: Updated description for USB_UP_LED.

• Table 4 “Pin description”: Added Table note 12 “If the RTC is not used, these pins can

be left floating.” for RTCX1 and RTCX2 pins.

• Table 4 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.”

for DBGEN, TMS, TDI, TRST, and RTCK pins.

• Table 4 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no

built-in pull-down resistor.” for TCK and TDO pins.

• Table 5 “Limiting values”: Added “non-operating” to conditions column of Tstg.

• Table 5 “Limiting values”: Updated Table note 5 “The maximum non-operating

storage temperature is different than the temperature for required shelf life which

should be determined based on required shelf lifetime. Please refer to the JEDEC

spec (J-STD-033B.1) for further details.”.

• Table 5 “Limiting values”: Updated storage temperature min/max to 65/+150.

• Added Table 7 “Thermal resistance value (C/W): ±15 %”.

• Added Table 10 “Dynamic characteristic: internal oscillators”.

• Added Table 11 “Dynamic characteristic: I/O pins[1]”.

• Table 8 “Static characteristics”: Changed Vhys typ value from 0.5VDD(3V3) to

0.05VDD(3V3).

• Table 13 “Dynamic characteristics of flash”: Updated table.

• Added Section 9 “Thermal characteristics”.

• Added Section 10.3 “Electrical pin characteristics”.

• Added Section 14.2 “Crystal oscillator XTAL input and component selection”.

• Added Section 14.3 “RTC 32 kHz oscillator component selection”.

• Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.

• Added Section 14.5 “Standard I/O pin configuration”.

• Added Section 14.6 “Reset pin configuration”.

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