LPC2364 datasheet(48/69 Pages) NXP

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LPC2364_65_66_67_68

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Product data sheet

Rev. 7.1 — 16 October 2013

48 of 69

NXP Semiconductors

LPC2364/65/66/67/68

Single-chip 16-bit/32-bit microcontrollers

11. Dynamic characteristics

[1]

Parameters are valid over operating temperature range unless otherwise specified.

[2]

Typical ratings are not guaranteed. The values listed are at room temperature (25

C), nominal supply voltages.

[3]

LPC2364HBD only.

[4]

Bus capacitance Cb in pF, from 10 pF to 400 pF.

Table 9.

Dynamic characteristics

Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified; VDD(3V3)

over specified ranges.[1]

Symbol

Parameter

Conditions

Min

Typ[2]

Max

Unit

ARM processor clock frequency

foper

operating frequency

CCLK;

40 C to +85 C1

MHz

CCLK; > 85

C

[3] 1-

MHz

IRC;

40 C to +85 C

3.96

4.04

MHz

IRC; > 85

C

[3] 3.98

4.02

4.06

MHz

External clock

fosc

oscillator frequency

MHz

Tcy(clk)

clock cycle time

1000

tCHCX

clock HIGH time

Tcy(clk)  0.4

tCLCX

clock LOW time

Tcy(clk)  0.4

tCLCH

clock rise time

tCHCL

clock fall time

I2C-bus pins (P0[27] and P0[28])

tf(o)

output fall time

VIH to VIL

20 + 0.1

 C

[4]

SSP interface

tsu(SPI_MISO)

SPI_MISO set-up time

Tamb = 25 C; measured

in SPI Master mode; see

Figure 15

-11

Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)

tCHCL

tCLCX

tCHCX

Tcy(clk)

tCLCH

002aaa907

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