AFE032 datasheet(2/77 Pages) TI1

2 / 77 page

AFE032

SBOS669A – AUGUST 2013 – REVISED DECEMBER 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

PA_VS

Supply voltage (pins 44, 45)

+26

Pins 3, 4, 6, 7, 8, 10

DGND – 0.4 to DVDD + 0.4

Pins 13, 21, 28, 31, 32, 38, 39

AGND – 0.4 to AVDD + 0.4

Voltage(2)

Pins 18, 19

PA_GND – 0.4 to PA_VS + 0.4

Pin 27

AVDD + 0.4 to 26

Signal input terminals

Pins 3, 4, 6, 7, 8, 10

±10

Pins 13, 21, 28, 31, 32, 38, 39

±10

Current(2)

Pins 18, 19

±10

Pin 35

±10

Pins 5, 9, 47, 48

DGND – 0.4 to DVDD + 0.4

Voltage

Pins 14, 17, 20, 22, 33, 36, 37

AGND – 0.4 to AVDD + 0.4

Pins 42, 43

PA_GND – 0.4 to PA_VS + 0.4

Signal output terminals

Current; short-circuit to GND

Pins 5, 9, 47, 48

Continuous

Current; short-circuit to GND

Pins 14, 17, 20, 22, 33, 36, 37

Continuous

Current; short-circuit to GND

Pins 42, 43

Continuous

AVDD

Analog supply voltage (pins 11, 30)

5.5

DVDD

Digital supply voltage

5.5

Operating temperature(3)

–40 to +150

°C

Tstg

Storage temperature

–55 to +150

°C

Junction temperature

+150

°C

Human body model (HBM)

3000

Electrostatic discharge

ESD

Machine model (MM)

200

ratings

Charged device model (CDM)

500

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute-

maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.4 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

The device automatically goes to shutdown above +165°C.

THERMAL INFORMATION

AFE032

THERMAL METRIC(1)

RGZ (QFN)

UNITS

48 PINS

θJA

Junction-to-ambient thermal resistance

22.5

θJCtop

Junction-to-case (top) thermal resistance

12.1

θJB

Junction-to-board thermal resistance

7.5

°C/W

ψJT

Junction-to-top characterization parameter

2.0

ψJB

Junction-to-board characterization parameter

5.4

θJCbot

Junction-to-case (bottom) thermal resistance

1.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Submit Documentation Feedback

Product Folder Links: AFE032

AFE032 Datasheet(PDF) 2 Page - Texas Instruments

AFE032 Datasheet(HTML) 2 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77

Datasheet Download

Link URL