AFE032 datasheet(67/77 Pages) TI1

67 / 77 page

0.5

1.5

2.5

Cu Thickness (oz)

Four-Layer PCB, PCB

Area = 4.32 in , 2 oz Cu

(Results are from thermal

simulations)

PCB Area (in )

THERMAL RESISTANCE vs BOARD AREA

Four-Layer PCB, 2 oz Cu

(Results are from thermal

simulations)

Number of Layers

THERMAL RESISTANCE vs NUMBER OF PCB LAYERS

PCB Area = 3 in , 2 oz Cu

(Results are from thermal

simulations)

AFE032

www.ti.com

SBOS669A – AUGUST 2013 – REVISED DECEMBER 2013

Increasing the number of layers in the PCB, using thicker copper, and increasing the PCB area are all factors

that improve the spread of heat. Figure 32 through Figure 34 show thermal resistance performance as a function

of each of these factors.

Figure 32. Thermal Resistance as a Function of

Figure 33. Thermal Resistance as a Function of

the Number of Layers in the PCB

PCB Area

Figure 34. Thermal Resistance as a Function of Copper Thickness

For additional information on thermal PCB design using exposed thermal pad packages, refer to Application

Reports Analog Front-End Design for a Narrowband Power-Line Communications Modem Using the AFE031

(SBOA130) and PowerPAD™ Thermally-Enhanced Package (SLMA002E) (both available for download at

www.ti.com).

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AFE032 Datasheet(PDF) 67 Page - Texas Instruments