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LP38851 Datasheet(PDF) 18 Page - Texas Instruments |
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LP38851 Datasheet(HTML) 18 Page - Texas Instruments |
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18 / 29 page ![]() LP38851 SNVS492C – JUNE 2007 – REVISED APRIL 2013 www.ti.com Heat-Sinking The SO PowerPad Package The LP38851MR package has a θJA rating of 168°C/W, and a θJC rating of 11°C/W. The θJA rating of 168°C/W includes the device DAP soldered to an area of 0.008 square inches (0.09 in x 0.09 in) of 1 ounce copper, with no airflow. Figure 34. θJA vs Copper (1 Ounce) Area for the SO PowerPad Package Increasing the copper area soldered to the DAP to 1 square inch of 1 ounce copper, using a dog-bone type layout, will improve the θJA rating to 98°C/W. Figure 34 shows that increasing the copper area beyond 1 square inch produces very little improvement. Figure 35. Maximum Power Dissipation vs Ambient Temperature for the SO PowerPad Package Figure 35 shows the maximum allowable power dissipation for the SO PowerPad package for a range of ambient temperatures, assuming θJA is 98°C/W and the maximum junction temperature is 125°C. 18 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LP38851 |
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