TS68302VR1BSLASHT16 datasheet(9/47 Pages) ATMEL

9 / 47 page

TS68302

2117A–HIREL–11/02

The total thermal resistance of a package (

JA) can be separated into two components,

JC and θCA, representing the barrier to heat flow from the semiconductor junction to the

package (case), surface (

JC) and from the case to the outside ambient (θCA). These

terms are related by the equation:

JA = θJC + θCA

(4)

JC is device-related and cannot be influenced by the user. However, θCA is user-depen-

dent and can be minimized by such thermal management techniques as heat sinks,

ambient air cooling and thermal convection. Thus, good thermal management on the

part of the user can significantly reduce

CA so that θJA approximately equals θJC. Substi-

tution of

JC for θJA in equation (1) will result in a lower semiconductor junction

temperature.

Mechanical and

Environment

The microcircuits shall meet all mechanical environmental requirements of either MIL-

STD-883 for class B devices or Atmel standards.

Marking

The document that defines the marking is identified in the related reference documents.

Each microcircuit is legible and permanently marked with the following information as

minimum:

•

Atmel Logo

•

Manufacturer’s part number

•

Class B identification

•

Date-code of inspection lot

•

ESD identifier if available

•

Country of manufacturing

Quality Conformance

Inspection

DESC/MIL-STD-883

Those quality levels are in accordance with MIL-M-38535 and method 5005 of MIL-

STD-883. Groups A and B inspections are performed on each production lot. Groups C

and D inspection are performed on a periodical basis.

Electrical

Characteristics

General Requirements

All static and dynamic electrical characteristics specified. For inspection purposes, refer

to relevant specification:

•

DESC see “DESC/MIL-STD-883” on page 9

Table 5 and Table 6: Static Electrical Characteristics for all electrical variants. Test

methods refer to IEC 748-2 method number, where existing.

Table 7 and Table 8: Dynamic Electrical Characteristics. Test methods refer to this

specification.

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