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FE150H Datasheet(PDF) 2 Page - Tyco Electronics |
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FE150H Datasheet(HTML) 2 Page - Tyco Electronics |
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2 / 8 page ![]() 2 2 Tyco Electronics Corp. Technical Note August 1997 High-Power Board-Mounted Power Modules Thermal Mangement for Basic Thermal Management (continued) However, efficiency is a nonlinear function of the mod- ule input voltage (VI) and output current (IO). Typically, a plot of power dissipation versus output current over three different line voltages is given in each module- specific data sheet. This is because each power mod- ule output voltage has a different power dissipation curve. The typical curves of PD vs. IO for three input voltages for the FE150A Power Module are shown in Figure 2. 8-583(C) Figure 2. FE150A Power Dissipation as Heat vs. Output Load Module Derating 200 Watt Power Modules Please see module specific data sheets for the FE200 and FW200 Series BMPMs. These modules have an 85 °C maximum case temperature. Forced Convection Without Heat Sinks Increasing the airflow over the module improves cool- ing. Figure 3 shows power derating vs. local ambient temperature (TA) at airflows from natural convection to 4.0 m/s (800 ft./min.) 8-587(C) Figure 3. Forced Convection Derating Without Heat Sinks The curves in Figure 3 were obtained from measure- ments made in a free stream of air approaching a verti- cally oriented module mounted on a printed-wiring board (PWB) in a rectangular passage, as shown in Figure 4. 8-690(C) Figure 4. Location for Measurements Figure 3 can be used to determine the appropriate airflow for a given set of operating conditions. For example, at PD = 20 W and TA = 40 °C, an airflow of 1.0 m/s (200 ft./min.) is sufficient to keep the module within its ratings. Heat Sinks Several standard heat sinks are available for high- power BMPMs, as shown in Figures 5 and 6 with their respective thermal resistances for natural convection. The heat sinks mount to the top surface of the module using #4-40 hardware torqued to 0.56 N-m (5 in.-lb.) Placing a thermally conductive dry pad or thermal grease between the case and the heat sink minimizes contact resistance and temperature drop. 40 30 20 10 0 0 5 10 15 20 25 30 OUTPUT CURRENT, IO (A) VI = 60 V VI = 50 V VI = 40 V 30 LOCAL AMBIENT TEMPERATURE, TA ( °C) 20 10 020 40 60 80 40 100 0 0.1 m/s (20 ft./min.) NATURAL CONVECTION 0.5 m/s (100 ft./min.) 1.0 m/s (200 ft./min.) 1.5 m/s (300 ft./min.) 2.0 m/s (400 ft./min.) 2.5 m/s (500 ft./min.) 3.0 m/s (600 ft./min.) 3.5 m/s (700 ft./min.) 4.0 m/s (800 ft./min.) FACING PWB AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE AIRFLOW PWB |
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