FE150H datasheet(3/8 Pages) MACOM

3 / 8 page

Tyco Electronics Corp.

Technical Note

August 1997

High-Power Board-Mounted Power Modules

Thermal Mangement for

Module Derating (continued)

Heat Sinks (continued)

8-691(C)

Figure 5. Heat Sink with Fins Oriented Along

Length

8-692(C)

Figure 6. Heat Sink with Fins Oriented Along Width

Natural Convection with Heat Sink

Figures 7 and 8 represent power derating for a module

in natural convection with the heat sinks shown in

Figures 5 and 6. Natural convection is the airﬂow pro-

duced when air in contact with a hot surface is heated,

causing it to rise. An open environment is required with

no external forces moving the air. Figures 7 and 8 apply

when the module is the only source of heat present in

the system.

8-693(C)

Figure 7. Heat-Sink Derating Curves; Natural

Convection; Fins Oriented Along Length

8-694(C)

Figure 8. Heat-Sink Derating Curves; Natural

Convection; Fins Oriented Along Width

With a known PD and TA, the appropriate heat sink can

be chosen from the derating curves. For example, if

PD = 20 W and TA = 30 °C with the heat sink oriented

along the width, the 0.5 in. heat sink would keep the

module within its temperature rating.

0.5 in. H = 5.7

°C/W

1.0 in. H = 3.1

°C/W

1.5 in. H = 2.4

°C/W

0.25 in. H = 6.3

°C/W

0.5 in. H = 4.8

°C/W

1.0 in. H = 2.6

°C/W

1.5 in. H = 2.1

°C/W

0.25 in. H = 5.6

°C/W

406080

100

LOCAL AMBIENT TEMPERATURE, TA (

°C)

1.5 in.

1.0 in.

NONE

0.25 in.

0.5 in.

406080

100

LOCAL AMBIENT TEMPERATURE, TA (

°C)

1.5 in.

1.0 in.

NONE

0.5 in.

0.25 in.

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