LM3519 datasheet(2/20 Pages) TI1

2 / 20 page

LM3519

SNVS394A – AUGUST 2005 – REVISED SEPTEMBER 2005

www.ti.com

Connection Diagram

6-Lead SOT23 Package

Figure 2. Top View

Pin Functions

Table 1. Pin Descriptions

Pin #

Name

Description

Device Enable Connection

Gnd

Ground Connection

VOUT

Output Voltage Connection

LED_rtn

White LED Current Sensing Input Connection

Drain Connection of the Internal Power Field Effect Transistor (FET) Switch

VIN

Input or Supply Voltage Connection

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

VIN , En, & LED_rtn Pin

−0.3V to +6.5V

VOUT , Sw Pin

−0.3V to +21V

Maximum Junction Temperature,

(TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

ESD Rating(2)

Human Body Model:

2kV

Machine Model:

200V

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is guaranteed. Operating Ratings do not imply guaranteed limits. For guaranteed performance limits and

associated test conditions, see the Electrical Characteristics table.

(2)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin.

Operating Ratings

(1)

Junction Temperature (TJ) Range

−40°C to +125°C

Ambient Temperature (TA) Range

−40°C to +85°C

Input Voltage Range

2.7V to 5.5V

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is guaranteed. Operating Ratings do not imply guaranteed limits. For guaranteed performance limits and

associated test conditions, see the Electrical Characteristics table.

Thermal Properties

(2)

Junction-to-Ambient Thermal Resistance (

θJA)

220°C/W

(2)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance,

θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power

dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature.

Submit Documentation Feedback

Product Folder Links: LM3519

LM3519 Datasheet(PDF) 2 Page - Texas Instruments

LM3519 Datasheet(HTML) 2 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Datasheet Download

Link URL