TSL2581, TSL2583

LIGHT-TO-DIGITAL CONVERTER

TAOS134A − JULY 2012

27

The LUMENOLOGY

r Company

r

r

Copyright

E 2012, TAOS Inc.

www.taosinc.com

PACKAGE INFORMATION

PACKAGE FN

Dual Flat No-Lead

203

+ 8

442

+ 10

650

BSC

650

+ 50

6 SDA

5 INT

4 SCL

ADDR SEL 2

GND 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

2000

+ 75

2000

+ 75

PIN 1

PIN 1

END VIEW

PIN OUT

TOP VIEW

Photo-Active Area

750

+ 150

295

Nominal

442

+ 10

C

Photodiode Array Area (Note B)

CL

140 Nominal

20 Nominal

of Photodiode Array Area

(Note B)

CL

NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is

± 20 μm unless otherwise noted.

B. The die is centered within the package within a tolerance of

± 75 μm.

C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

E. This package contains no lead (Pb).

F. This drawing is subject to change without notice.

Figure 11. Package FN — Dual Flat No-Lead Packaging Configuration