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XC6503 Datasheet(PDF) 21 Page - Torex Semiconductor |
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XC6503 Datasheet(HTML) 21 Page - Torex Semiconductor |
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21 / 26 page ![]() 21/26 XC6503 Series ■ PACKAGING INFORMATION (Continued) ● USP-4 Power Dissipation Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. Board Mount (Tj max = 125℃) Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W) 25 1000 85 400 100.00 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit:mm) Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd Vs. Ta 0 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient TemperatureTa: (℃) Ambient Temperature: Ta (℃) |
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