XC6503 datasheet(22/26 Pages) TOREX

22 / 26 page

XC6503 Series

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PACKAGING INFORMATION (Continued)

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SOT-25 Power Dissipation

Power dissipation data for the SOT-25 is shown in this page.

22/26

The value of power dissipation varies with the mount board conditions.

評価基板レイアウト（単位：mm）

Evaluation Board (Unit: mm)

Please use this data as one of reference data taken in the described condition.

Measurement Condition (Reference data)

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead (Pb) free

Board:

Dimensions 40 x 40 mm (1600 mm in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

(Board of SOT-26 is used.)

Material:

Glass Epoxy (FR-4)

Thickness:

1.6 mm

Through-hole:

4 x 0.8 Diameter

2. Power Dissipation vs. Ambient temperature

Board Mount (Tj max = 125℃)

Ambient Temperature（℃）

Power Dissipation Pd（mW）

Thermal Resistance (℃/W)

600

240

166.67

Pd-Ta特性グラフ

100

200

300

400

500

600

700

105

125

周辺温度Ta（℃）

Pd vs. Ta

Ambient Temperature: Ta (℃)

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