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UPD17217 Datasheet(PDF) 76 Page - NEC |
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UPD17217 Datasheet(HTML) 76 Page - NEC |
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76 / 84 page  µPD17215, 17216, 17217, 17218 76 17. RECOMMENDED SOLDERING CONDITIONS For the µPD17215, 17216, 17217, and 17218, soldering must be performed under the following conditions. For details of recommended conditions for surface mounting, refer to information document "Semiconductor device mounting technology manual" (C10535E). For other soldering methods, please consult with NEC personnel. Table 17-1 Soldering Conditions of Surface Mount Tye µPD17215GT-xxx: 28-pin plastic SOP (375 mil) µPD17216GT-xxx: 28-pin plastic SOP (375 mil) µPD17217GT-xxx: 28-pin plastic SOP (375 mil) µPD17218GT-xxx: 28-pin plastic SOP (375 mil) Soldering Method Soldering Conditions Symbol Infrated Reflow Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.), IR35-207-2 Number of times: 2 max., Days: 7 days* (after that, prebaking is necessary for 20 hours at 125 °C) <Cautions> Products other than those supplied in thermal-resistant tray (magazine, taping, and non-thermal-resistant tray) cannot be baked in their packs. VPS Package peak temperature: 215 °C, Time: 40 seconds max. (210 °C min.), VP15-207-2 Number of times: 2 max., Days: 7 days* (after that, prebaking is necessary for 20 hours at 125 °C) <Cautions> Products other than those supplied in thermal-resistant tray (magazine, taping, and non-thermal-resistant tray) cannot be baked in their packs. Partial Heating Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device) — *: The number of days the device can be stored after the dry pack was opened, under storage conditions of 25 °C and 65 % RH max. Caution: Do not use two or more solderong methods in combination (except the partial heating method). Table 17-2 Soldering Conditions of Through-Hole Tye µPD17215CT-xxx: 28-pin plastic shrink DIP (400 mil) µPD17216CT-xxx: 28-pin plastic shrink DIP (400 mil) µPD17217CT-xxx: 28-pin plastic shrink DIP (400 mil) µPD17218CT-xxx: 28-pin plastic shrink DIP (400 mil) Soldering Method Soldering Conditions Wave Soldering Solder bath temperature: 260 °C max., Time: 10 seconds max. (Only for pins) Partial Heating Pin temperature: 300 °C max., Time: 3 seconds max. (per pin) Caution: The wave solding must be performed at the lead part only. Note that the solder must not be directly contacted to the package body. |
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