 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
UPD178024GC Datasheet(PDF) 46 Page - NEC |
|
|
|||||||||||||||||||||||||||||
UPD178024GC Datasheet(HTML) 46 Page - NEC |
|
|
46 / 56 page  46 µPD178023, 178024 Data Sheet U14126EJ1V0DS00 10. RECOMMENDED SOLDERING CONDITIONS Solder this product under the following recommended conditions. For details of the recommended soldering conditions, refer to information document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended, consult NEC. Table 10-1. Soldering Conditions for Surface-Mount Type µPD178023GF-XXX-3B9: 80-pin plastic QFP (14 × 20 mm, 0.8-mm pitch) µPD178024GF-XXX-3B9: 80-pin plastic QFP (14 × 20 mm, 0.8-mm pitch) Soldering Method Soldering Conditions Recommended Conditions Symbol Infrared reflow Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.), IR35-00-3 Number of times: 3 max. VPS Package peak temperature: 215 °C, Time: 40 sec max. (200 °C min.), VP15-00-3 Number of times: 3 max. Wave soldering Solder bath temperature: 260 °C max., Time: 10 sec max., WS60-00-1 Number of times: 1, Preheating temperature: 120 °C max., (Package surface temperature) Partial heating Pin temperature: 300 °C max., Time: 3 sec max (per device side) – Caution Do not use two or more soldering methods in combination (except partial heating). µPD178023GC-XXX-8BT: 80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch) µPD178024GC-XXX-8BT: 80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch) Soldering Method Soldering Conditions Recommended Conditions Symbol Infrared reflow Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.), IR35-00-2 Number of times: 2 max. VPS Package peak temperature: 215 °C, Time: 40 sec max. (200 °C min.), VP15-00-2 Number of times: 2 max. Wave soldering Solder bath temperature: 260 °C max., Time: 10 sec max., WS60-00-1 Number of times: 1, Preheating temperature: 120 °C max., (Package surface temperature) Partial heating Pin temperature: 300 °C max., Time: 3 sec max (per device side) – Caution Do not use two or more soldering methods in combination (except partial heating). |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
