| Electronic Components Datasheet Search |
|
AN3994 Datasheet(PDF) 39 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
AN3994 Datasheet(HTML) 39 Page - STMicroelectronics |
|
39 / 53 page ![]() AN3994 MOSFET critical parameters in high switching environments Doc ID 022380 Rev 1 39/53 On the contrary, when high drain currents/high ΔI/dt are involved, the induced voltage V Ls becomes large enough to significantly interfere with the gate bias. A second order effect related to the source inductance is that RGtot, Ls, and Ciss (at turn-on) are the RLC components of a series resonant circuit, as shown in Figure 46. Figure 46. Simplified equivalent series resonant model of the driving circuit of a MOSFET As far as the resonance aspect is concerned, the phenomenon is due to the Ls inductor and the MOSFET input capacitor energy exchange (if turn-off is considered, the capacitor involved is the drain source Cds). This results in the output current (gate current IG) and voltage oscillatory spikes which can lead to unwanted turn-on if the VGS voltage reaches the threshold value. The Q factor of the resonant circuit which is also related to the Ls value and is responsible of the output signal time response, can be reduced by increasing the total gate resistor components along the driving loop (which comprises the external RG, the MOSFET intrinsic RG and the driver output impedance). If especially small sizes are involved, a higher gate resistor causes under damped oscillations in the gate drive voltage waveforms but results in turn-on/turn-off time widening. On the other hand, if RG values need to be lowered to optimize the energy losses at turn-on and turn-off, the user must accept the possibility of spurious gate driving waveforms. 7.3 Minimizing common source inductance: layout optimization and Kelvin source connection on STW77N65M5 The negative impact on turn-on and turn-off energy losses, due to the source inductance, can be minimized by taking particular care of the layout during the design phase: the gate driving loop should be as short as possible to minimize the total parasitic loop inductance and more precisely, the common source wiring between the commutation loop and the gate loop should be as short as possible (ideally zero) to minimize the slowing action of the Ls on the drain current. This could be accomplished by placing the driving stage GND directly connected to the source pin of the switch or very close to it, as shown in Figure 47. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |