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LTC1267 Datasheet(PDF) 13 Page - Linear Technology |
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LTC1267 Datasheet(HTML) 13 Page - Linear Technology |
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13 / 16 page ![]() 13 LTC1267 LTC1267-ADJ/LTC1267-ADJ5 APPLICATIO S I FOR ATIO and inductor core losses, generally account for less than 2% total additional loss. Auxiliary Windings––Suppressing Burst Mode Operation The LTC1267 synchronous switch removes the normal limitation that power must be drawn from the inductor primary winding in order to extract power from auxiliary windings. With synchronous switching, auxiliary outputs may be loaded without regard to the primary output load, providing that the loop remains in continuous mode operation. Burst Mode operation can be suppressed at low output currents with a simple external network which cancels the 25mV minimum current comparator threshold. This tech- nique is also useful for eliminating audible noise from certain types of inductors in high current (IOUT > 5A) applications when they are lightly loaded. An external offset is put in series with the Sense – pin to subtract from the built-in 25mV offset. An example of this technique is shown in Figure 7. Two 100 Ω resistors are inserted in series with the sense leads from the sense resistor. L RSENSE + COUT LTC1267 • F07 SENSE+ LTC1267 1000pF R3 SENSE– R2 100 Ω R1 100 Ω Figure 7. Suppressing Burst Mode Operation With the addition of R3 a current is generated through R1 causing an offset of: VOFFSET = VOUT ) ) R1 R1 + R3 If VOFFSET > 25mV, the built-in offset will be cancelled and Burst Mode operation is prevented from occurring. Since VOFFSET is constant, the maximum load current is also decreased by the same offset. Thus, to get back to the same IMAX, the value of the sense resistor must be reduced: RSENSE ≈ m Ω 75 IMAX To prevent noise spikes from erroneously tripping the current comparator, a 1000pF capacitor is needed across Sense+ and Sense– pins. Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC1267. These items are also illustrated graphically in the layout diagram of Figure 8. In general each block should be self-contained with little cross coupling for best performance. Check the following in your layout: 1. Are the signal and power grounds segregated? The LTC1267 signal ground must return to the (–) plate of COUT. The power ground returns to the source of the N-channel MOSFET, anode of the Schottky diode, and (–) plate of CIN, which should have as short lead lengths as possible. 2. Does the LTC1267 Sense – pin connect to a point close to RSENSE and the (+) plate of COUT? In adjustable applications the resistive divider R1 and R2 must be connected between the (+) plate of COUT and signal ground. 3. Are the Sense – and Sense + leads routed together with minimum PC trace spacing? The 1000pF capacitor between the two Sense pins should be as close as possible to the LTC1267. Up to 100 Ω may be placed in series with each Sense lead to help decouple the Sense pins. However, when these resistors are used the capacitor should be no larger than 1000pF. 4. Does the (+) plate of CIN connect to the source of the P-channel MOSFET as closely as possible? An addi- tional 0.1 µF ceramic capacitor between VIN and power ground may be required in some applications. 5. Is the VCC decoupling capacitor connected closely between the VCC pins of the LTC1267 and power ground? This capacitor carries the MOSFET driver peak currents. |
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