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UPD98405 Datasheet(PDF) 8 Page - NEC |
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UPD98405 Datasheet(HTML) 8 Page - NEC |
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8 / 64 page ![]() Data Sheet S12689EJ2V0DS00 8 µµµµPD98405 CONTENTS 1. PIN FUNCTIONS ............................................................................................................................... 9 1.1 PHY Layer Device Interface Signal .......................................................................................... 9 1.1.1 UTOPIA interface ........................................................................................................................... 9 1.1.2 PHY device control interface (external PHY mode, PHM of GMR register = 1) ............................. 11 1.2 Bus Interface Signals ................................................................................................................ 12 1.2.1 Generic bus interface signals (PCI_MODE pin: low level)............................................................. 12 1.2.2 PCI bus interface signal (PCI_MODE pin: high level).................................................................... 15 1.3 Control Memory Interface Signals ........................................................................................... 19 1.4 PMD Interface Signals (internal PHY mode, PHM of GMR register = 0) ............................... 20 1.5 JTAG Boundary Scan Signals .................................................................................................. 21 1.6 Other Signals ............................................................................................................................. 21 1.7 Power and Ground..................................................................................................................... 22 1.8 Pin Status during and after Reset ............................................................................................23 2. ELECTRICAL SPECIFICATIONS ..................................................................................................... 25 3. PACKAGE DRAWING ...................................................................................................................... 60 4. RECOMMENDED SOLDERING CONDITIONS ............................................................................... 61 |
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