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LPV542 Datasheet(PDF) 4 Page - Texas Instruments |
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LPV542 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 29 page ![]() LPV542 SNOSCX9 – MARCH 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Supply voltage, V+ to V– -0.3 6 V Voltage(2) (V-) - 0.3 (V+) + 0.3 V Signal input pins Current(2) -10 10 mA Output short current Continuous(4) Junction temperature -40 150 °C Storage temperature, Tstg -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current-limited to 10 mA or less. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) Short-circuit to V-. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Electrostatic V(ESD) V Charged device model (CDM), per JEDEC specification JESD22-C101, discharge ±250 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Ratings MIN NOM MAX UNIT Supply Voltage ( V+– V− ) 1.6 5.5 V Specified Temperature -40 125 °C 6.4 Thermal Information DGK (VSSOP) DNX (X1SON) THERMAL METRIC(1) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 46.3 RθJC(top) Junction-to-case (top) thermal resistance 33.3 RθJB Junction-to-board thermal resistance 21 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 21.2 RθJC(bot) Junction-to-case (bottom) thermal resistance 7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LPV542 |
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