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CC2640 Datasheet(PDF) 13 Page - Texas Instruments

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Part # CC2640
Description  CC2640 SimpleLink Bluetooth Smart Wireless MCU
PDF  51 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CC2640 Datasheet(HTML) 13 Page - Texas Instruments

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CC2640
www.ti.com
SWRS176 – FEBRUARY 2015
5
Specifications
5.1
Absolute Maximum Ratings
(1) (2)
[over operating free-air temperature range (unless otherwise noted)] Under no circumstances must the absolute maximum
ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device.
MIN
MAX
UNIT
VDDR supplied by internal DC/DC regulator or
Supply voltage, VDDS(3)
–0.3
4.1
V
internal GLDO
External regulator mode (VDDS and VDDR pins
Supply voltage, VDDS(3) and VDDR
–0.3
2.25
V
connected on PCB)
VDDS+0.3, max
Voltage on any digital pin(4)
–0.3
V
4.1
Voltage on crystal oscillator pins,
VDDR+0.3, max
X32K_Q1, X32K_Q2, X24M_N and
–0.3
V
2.25
X24M_P
Internal fixed or relative reference, voltage
–0.3
VDDS
scaling enabled
Internal fixed reference, voltage scaling disabled
–0.3
1.49
Internal relative reference, voltage scaling
Voltage on ADC input (Vin)
–0.3
VDDS / 2.9
V
disabled
min (Vref × 2.9,
External reference, voltage scaling enabled
–0.3
VDDS)
External reference, voltage scaling disabled
–0.3
Vref
Voltage on external ADC reference
–0.3
1.6
V
(Vref)
Input RF level
+5
dBm
Tstg
Storage temperature
–40
150
°C
(1)
All voltage values are with respect to VDDS, unless otherwise noted.
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3)
VDDS2 and VDDS3 needs to be at the same potential as VDDS.
(4)
Including analog capable DIO.
5.2
ESD Ratings
VALUE
UNIT
Human Body Model (HBM), per ANSI/ESDA/JEDEC
All pins
±2500
JS001(1)
Electrostatic discharge
VESD
V
(ESD) performance:
RF pins
±750
Charged Device Model (CDM), per JESD22-C101(2)
non-RF pins
±750
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3
Recommended Operating Conditions
The operating conditions for CC2640 are listed below.
MIN
MAX
UNIT
Ambient temperature range
–40
85
°C
Operating supply voltage
For operation in 1.8 V systems
(VDDS and VDDR), external
(VDDS and VDDR pins connected on PCB, internal DC/DC
1.7
1.95
V
regulator mode
cannot be used)
Operating supply voltage
For operation in battery-powered and 3.3 V systems
1.8
3.8
V
(VDDS)
(internal DC/DC can be used to minimize power consumption)
Rising supply voltage slew rate
0
100
mV/us
Falling supply voltage slew rate
0
20
mV/us
Copyright © 2015, Texas Instruments Incorporated
Specifications
13
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