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AM5728 Datasheet(PDF) 199 Page - Texas Instruments |
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AM5728 Datasheet(HTML) 199 Page - Texas Instruments |
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199 / 415 page ![]() CL= C C f1 2 f (C +C ) 2 f1 f vssa_osc0 Device xo_osc0 xi_osc0 C f1 Crystal Rd C f2 (Optional) Rd (Optional) AM5728, AM5726 www.ti.com SPRS915O – MARCH 2014 – REVISED OCTOBER 2015 • The source of the internal system clock (SYS_32K) could be either: – A CMOS clock that enters on the rtc_osc_xi_clkin32 ball and supports external LVCMOS clock generators – A crystal oscillator clock managed by rtc_osc_xi_clkin32 and rtc_osc_xo. 6.1.2 System Oscillator OSC0 Input Clock SYS_CLKIN1 is received directly from oscillator OSC0. For more information about SYS_CLKIN1 see Device TRM, Chapter: Power, Reset, and Clock Management. 6.1.2.1 OSC0 External Crystal An external crystal is connected to the device pins. Figure 6-2 describes the crystal implementation. Figure 6-2. Crystal Implementation NOTE The load capacitors, Cf1 and Cf2 in Figure 6-2, should be chosen such that the below equation is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator xi_osc0, xo_osc0, and vssa_osc0 pins. Figure 6-3. Load Capacitance Equation The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-1 summarizes the required electrical constraints. Table 6-1. OSC0 Crystal Electrical Characteristics NAME DESCRIPTION MIN TYP MAX UNIT fp Parallel resonance crystal frequency 19.2, 20, 27 MHz Cf1 Cf1 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF Cf2 Cf2 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF ESR(Cf1,Cf2) Crystal ESR 100 Ω Copyright © 2014–2015, Texas Instruments Incorporated Clock Specifications 199 Submit Documentation Feedback Product Folder Links: AM5728 AM5726 |
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