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LP38855 Datasheet(PDF) 4 Page - Texas Instruments

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Part # LP38855
Description  1.5A Fast-Response High-Accuracy LDO Linear Regulator with Enable
PDF  20 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LP38855 Datasheet(HTML) 4 Page - Texas Instruments

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LP38855
SNVS461D – OCTOBER 2006 – REVISED APRIL 2013
www.ti.com
Electrical Characteristics (continued)
Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1µF, VEN = VBIAS.
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ENABLE Pin
VEN = VBIAS
-
0.01
-
IEN
ENABLE pin Current
µA
-19
-40
VEN = 0.0V, VBIAS = 5.5V
-30
-13
-51
1.00
1.50
VEN(ON)
Enable Voltage Threshold
VEN rising until Output = ON
1.25
V
0.90
1.55
VEN falling from VEN(ON) until
50
150
VEN(HYS)
Enable Voltage Hysteresis
100
mV
Output = OFF
30
200
tOFF
Turn-OFF Delay Time
RLOAD × COUT << tOFF
-
20
-
µs
tON
Turn-ON Delay Time
RLOAD × COUT << tON
-
15
-
AC Parameters
VIN = VOUT +1V, f = 120 Hz
-
80
-
PSRR
Ripple Rejection for VIN Input
dB
(VIN)
Voltage
VIN = VOUT + 1V, f = 1 kHz
-
65
-
VBIAS = VOUT + 3V, f = 120 Hz
-
58
-
PSRR
Ripple Rejection for VBIAS Voltage
dB
(VBIAS)
VBIAS = VOUT + 3V, f = 1 kHz
-
58
-
Output Noise Density
f = 120 Hz
-
1
-
µV/
√Hz
en
BW = 10 Hz
− 100 kHz
-
150
-
Output Noise Voltage
µVRMS
BW = 300 Hz
− 300 kHz
-
90
-
Thermal Parameters
TSD
Thermal Shutdown Junction
-
160
-
Temperature
°C
TSD(HYS)
Thermal Shutdown Hysteresis
-
10
-
TO-220-5
-
60
-
Thermal Resistance, Junction to
θJA
Ambient(4)
DDPAK/TO-263-5
-
60
-
°C/W
TO-220-5
-
3
-
Thermal Resistance, Junction to
θJC
Case(4)
DDPAK/TO-263-5
-
3
-
(4)
Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to
ambient thermal resistance (
θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
4
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Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LP38855



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