LM8801 datasheet(3/23 Pages) TI

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LM8801

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SNVS597H – APRIL 2009 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2)

VIN Pin to GND

−0.2V to 6.0V

EN, MODE pin to GND

−0.2V to 6.0V

FB, SW pin

(GND

−0.2V) to

(VIN + 0.2V) w/ 6.0V max

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

Continuous Power Dissipation (3)

Internally Limited

Maximum Lead Temperature

260°C

(Soldering, 10 sec.)

ESD Rating (4)

Human Body Model

2 kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(4)

The Human Body Model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883–3015.7.

Operating Ratings

(1) (2)

Input Voltage Range

2.3V to 5.5V

Recommended Load Current

0 mA to 600 mA

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C),

the maximum power dissipation of the device in the application (PD-MAX) and the junction-to-ambient thermal resistance of the

part/package (

θJA) in the application, as given by the following equation: TA-MAX = TJ-MAX− (θJAx PD-MAX). Due to the pulsed nature of

testing the part, the temp in the Electrical Characteristic table is specified as TA = TJ.

ThermaL Characteristics

Junction-to-Ambient Thermal Resistance (

θJA) (DSBGA)

(1)

85°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high power dissipation

exists, special care must be given to thermal dissipation issues in board design.

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