OPA211-EP datasheet(6/26 Pages) TI

6 / 26 page

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Continuous TJ (°C)

OPA211-EP

SBOS638 – JUNE 2012

www.ti.com

ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued)

BOLDFACE limits apply over the specified temperature range, TA = –55°C to +125°C.

At TA = +25°C, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

OUTPUT

Voltage Output

VOUT

RL = 10kΩ, AOL ≥ 114dB

(V–) + 0.2

(V+) – 0.2

RL = 600Ω, AOL ≥ 110dB

(V–) + 0.6

(V+) – 0.6

IO < 15mA, AOL ≥ 110dB

(V–) + 0.6

(V+) – 0.6

Short-Circuit Current

ISC

+30/–45

Capacitive Load Drive

CLOAD

See Typical Characteristics

Open-Loop Output Impedance

f = 1MHz

Ω

SHUTDOWN

Shutdown Pin Input Voltage

(1)

Device disabled (shutdown)

(V+) – 0.35

Device enabled

(V+) – 3

Shutdown Pin Leakage Current

μA

Turn-On Time

(2)

μs

Turn-Off Time

(2)

μs

Shutdown Current

Shutdown (disabled)

μA

POWER SUPPLY

Specified Voltage

±2.25

±18

Quiescent Current

IOUT = 0A

3.6

4.5

(per channel)

Over Temperature

TEMPERATURE RANGE

Operating Range

–55

+125

°C

Thermal Resistance

θ JA

200

°C/W

(1)

When disabled, the output assumes a high-impedance state.

(2)

See Typical Characteristic curves, Figure 42 through Figure 44.

See datasheet for absolute maximum and minimum recommended operating conditions.

Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect

life).

Figure 1. OPA211-EP Wirebond Life Derating Chart

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