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OPA180IDBVT Datasheet(PDF) 22 Page - Texas Instruments |
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OPA180IDBVT Datasheet(HTML) 22 Page - Texas Instruments |
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22 / 38 page ![]() NC ±IN +IN V± V+ OUT NC NC VS+ GND VS± (or GND for single supply) GND Only needed for dual-supply operation Ground (GND) plane on another layer VOUT VIN GND Run the input traces as far away from the supply lines as possible Use low-ESR, ceramic bypass capacitor RF RG RIN Place components close to device and to each other to reduce parasitic errors + VIN VOUT RIN RG RF (Schematic Representation) OPA180, OPA2180, OPA4180 SBOS584D – NOVEMBER 2011 – REVISED MAY 2014 www.ti.com 11 Layout 11.1 Layout Guidelines For best operational performance of the device, use good printed circuit board (PCB) layout practices, including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole and op amp itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supply applications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds paying attention to the flow of the ground current. For more detailed information refer to the Circuit Board Layout Techniques (SLOA089). • In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. • Place the external components as close to the device as possible. As shown in Figure 35, keeping RF and RG close to the inverting input will minimize parasitic capacitance. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. 11.2 Layout Example Figure 35. Operational Amplifier Board Layout for Noninverting Configuration 22 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: OPA180 OPA2180 OPA4180 |
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