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CDCVF2310 Datasheet(PDF) 14 Page - Texas Instruments |
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CDCVF2310 Datasheet(HTML) 14 Page - Texas Instruments |
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14 / 23 page ![]() Chip Supply C 0.1 µF V CC Ferrite Bead C 1 µF C 10 µF Board Supply CDCVF2310 SCAS666D – JUNE 2001 – REVISED OCTOBER 2015 www.ti.com 10 Power Supply Recommendations High-performance clock buffers are sensitive to noise on the power supply, which can dramatically increase the additive jitter of the buffer. Thus, it is essential to reduce noise from the system power supply, especially when jitter or phase noise is critical to applications. Filter capacitors are used to eliminate the low-frequency noise from the power supply, where the bypass capacitors provide the very low impedance path for high-frequency noise and guards the power supply system against induced fluctuations. These bypass capacitors also provide instantaneous current surges as required by the device and should have low equivalent series resistance (ESR). To properly use the bypass capacitors, they must be placed very close to the power-supply terminals and laid out with short loops to minimize inductance. TI recommends adding as many high-frequency (for example, 0.1 µF) bypass capacitors, as there are supply terminals in the package. TI recommends, but does not require, inserting a ferrite bead between the board power supply and the chip power supply that isolates the high-frequency switching noises generated by the clock buffer; these beads prevent the switching noise from leaking into the board supply. It is imperative to choose an appropriate ferrite bead with very low DC resistance to provide adequate isolation between the board supply and the chip supply, as well as to maintain a voltage at the supply terminals that is greater than the minimum voltage required for proper operation. Figure 12 shows this recommended power supply decoupling method. Figure 11. Power Supply Decoupling 14 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: CDCVF2310 |
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