TUSB322I

SLLSEO5 – OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

6.0

V

CC1, CC2, ADDR, ID, DIR, INT_N/OUT3, EN_N

–0.3

Control pins

SDA/OUT1, SCL/OUT2

–0.3

V

VBUS_DET

–0.3

4

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

4.5

5

5.5

V

4

5

28

V

DC voltage range for control lines: ADDR, ID, DIR, INT_N/OUT3, SDA/OUT1,

0

5.5

V

VCONTR SCL/OUT2, EN_N, CC1, and CC2.

OL

DC voltage range for VBUSDET

0

4

V

VCONN

4.75

5.5

V

Operating free-air temperature

TUSB322I

–40

25

85

°C

6.4 Thermal Information

TUSB322I

RWB (X2QFN)

UNIT

12 PINS

Junction-to-ambient thermal resistance

169.3

°C/W

Junction-to-case (top) thermal resistance

68.1

°C/W

Junction-to-board thermal resistance

83.4

°C/W

Junction-to-top characterization parameter

2.2

°C/W

Junction-to-board characterization parameter

83.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report, SPRA953.

4

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