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GS1670 Datasheet(PDF) 124 Page - Semtech Corporation |
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GS1670 Datasheet(HTML) 124 Page - Semtech Corporation |
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124 / 126 page  GS1670 HD/SD SDI Receiver Data Sheet 53831 - 2 September 2012 124 of 126 7.2 Packaging Data 7.3 Marking Diagram Table 7-1:Packaging Data Parameter Value Package Type 11mm x 11mm 100-ball LBGA Package Drawing Reference JEDEC M0192 (with exceptions noted in Package Dimensions on page 123). Moisture Sensitivity Level 3 Junction to Case Thermal Resistance, θj-c 15.4°C/W Junction to Air Thermal Resistance, θj-a (at zero airflow) 37.1°C/W Junction to Board Thermal Resistance, θj-b 26.4°C/W Psi, ψ 0.4°C/W Pb-free and RoHS Compliant Yes Pin 1 Indicator GS1670 XXXXXXE3 YYWW XXXXXX - Last 6 digits (excluding decimal) of SAP Batch Assembly (FIN) as listed on Packing Slip YYWW - Date Code E3 - Pb-free & Green indicator |
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