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LM4756 Datasheet(PDF) 13 Page - National Semiconductor (TI) |
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LM4756 Datasheet(HTML) 13 Page - National Semiconductor (TI) |
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13 / 17 page ![]() Application Information (Continued) and power op amps should have their supply leads by- passed with low-inductance capacitors having short leads. All high frequency bypass capacitors should be located as close to the package terminals as possible and have a clear unobstructed current return path to ground. It is typical to use capacitor values that are a factor of 100 different from each other to minimize interaction with each other. The LM4756 should be bypassed with 0.1µF ceramic and 100µF tantalum capacitors for optimum performance. The 100µF tantalum can be replaced with an electrolytic, but the bypassing per- formance of the tantalum will be better. There should also be large supply reservoir capacitors of about 4700µF on each supply rail. A larger reservoir capacitor will reduce the supply ripple and will supply larger current burst requirements in- stead of requiring those large currents to come from the main power supply transformer. If adequate bypassing is not provided, the current in the supply leads, which is a rectified component of the load current, may be fed back into internal circuitry. This signal may cause signal distortion to increase. Layout and Ground Loops When designing a printed circuit board layout, it is important to return the load ground, any output compensation ground, and the low-level (feedback and input) grounds to the circuit board common ground point through separate paths. Large currents flowing along a ground conductor will generate voltages which effectively act as signals to the input ground reference. This can result in high frequency oscillation or excessive distortion. Output compensation components and the high frequency supply bypass capacitors should be placed as close as possible to the IC to reduce the effects of PCB trace resistance and inductance. For cases where long traces must exist, widen the traces to minimize their induc- tance. References International Electronic Research Corporation P.O. Box 7704, Burbank, California 91510-7704, (818) 842-7277 Thermalloy Inc. P.O. Box 810839, Dallas, Tx 75381-0839, (214) 243-4321, www.thermalloy.com www.national.com 13 |
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