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LM4756 Datasheet(PDF) 13 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM4756
Description  Dual 7W Audio Power Amplifier w/Mute, Standby and Volume Control
PDF  17 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM4756 Datasheet(HTML) 13 Page - National Semiconductor (TI)

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Application Information (Continued)
and power op amps should have their supply leads by-
passed with low-inductance capacitors having short leads.
All high frequency bypass capacitors should be located as
close to the package terminals as possible and have a clear
unobstructed current return path to ground. It is typical to use
capacitor values that are a factor of 100 different from each
other to minimize interaction with each other. The LM4756
should be bypassed with 0.1µF ceramic and 100µF tantalum
capacitors for optimum performance. The 100µF tantalum
can be replaced with an electrolytic, but the bypassing per-
formance of the tantalum will be better. There should also be
large supply reservoir capacitors of about 4700µF on each
supply rail. A larger reservoir capacitor will reduce the supply
ripple and will supply larger current burst requirements in-
stead of requiring those large currents to come from the
main power supply transformer.
If adequate bypassing is not provided, the current in the
supply leads, which is a rectified component of the load
current, may be fed back into internal circuitry. This signal
may cause signal distortion to increase.
Layout and Ground Loops
When designing a printed circuit board layout, it is important
to return the load ground, any output compensation ground,
and the low-level (feedback and input) grounds to the circuit
board common ground point through separate paths. Large
currents flowing along a ground conductor will generate
voltages which effectively act as signals to the input ground
reference. This can result in high frequency oscillation or
excessive distortion. Output compensation components and
the high frequency supply bypass capacitors should be
placed as close as possible to the IC to reduce the effects of
PCB trace resistance and inductance. For cases where long
traces must exist, widen the traces to minimize their induc-
tance.
References
International Electronic Research Corporation
P.O. Box 7704,
Burbank, California 91510-7704,
(818) 842-7277
Thermalloy Inc.
P.O. Box 810839,
Dallas, Tx 75381-0839,
(214) 243-4321,
www.thermalloy.com
www.national.com
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