LM3281 datasheet(5/26 Pages) TI1

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LM3281

www.ti.com

SNVSA38 – NOVEMBER 2014

6.4 Thermal Information

DSBGA

THERMAL METRIC(1)

YFQ

UNIT

6 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

131.2

RθJC(top)

Junction-to-case (top) thermal resistance

1.7

RθJB

Junction-to-board thermal resistance

25.6

°C/W

ψJT

Junction-to-top characterization parameter

4.7

ψJB

Junction-to-board characterization parameter

25.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

RθJA is not useful for CSP packages because the dominant heat loss mechanism is through the PCB. Instead, RθJB is more useful and

is used.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input voltage range(4)

5.5

VOUT

Output voltage measured at FB pin

3.2

3.3

3.4

ISHDN_IN

Total supply current in shutdown

EN = SW = FB = MODE = 0 V,

0.1

Steady State

µA

IQ_OL

Quiescent current

No switching

FOSC

Internal oscillator frequency

5.4

6.6

MHz

VIH

EN, MODE pins high level input

1.2

voltage

VIL

EN, MODE pins low level input voltage

0.4

IIH

EN, MODE high level input current

µA

IIL

EN, MODE low level input current

EN = MODE = 0 V

–1

(1)

All voltages are with respect to the GND pin.

(2)

All characteristics apply to the Simplified Schematic with VIN = 3.8 V, EN = MODE = VIN, at TA = 25°C, device in PWM operation unless

otherwise noted.

(3)

Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis over the ambient temperature operating

range –30°C to 90°C. Limits are not specified by production testing.

(4)

Device is functional at a minimum VIN = 2.6 V but is specified for operation over the range VIN = 3 V to 5.5 V.

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