ISP1301 datasheet(44/46 Pages) PHILIPS

44 / 46 page

Philips Semiconductors

ISP1301

USB OTG transceiver

Product data

Rev. 01 — 14 April 2004

44 of 46

9397 750 11355

[3]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or

larger than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than

0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex

foil by using a hot bar soldering process. The appropriate soldering proﬁle can be provided on

request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

21. Revision history

Table 53:

Revision history

Rev Date

CPCN

Description

20040414

Product data (9397 750 11355).

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