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GXM Datasheet(PDF) 182 Page - National Semiconductor (TI) |
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GXM Datasheet(HTML) 182 Page - National Semiconductor (TI) |
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182 / 244 page  www.national.com 182 Revision 3.1 7.0 Electrical Specifications This section provides information on electrical connec- tions, absolute maximum ratings, required operating con- ditions, DC characteristics, and AC characteristics for the Geode GXm processor. All voltage values in the Electrical Specifications are with respect to VSS unless otherwise noted. For detailed information on the PCI bus electrical specification refer to Chapter 4 of the PCI Bus Specifica- tion, Revision 2.1. 7.1 PART NUMBERS The following part numbers designate the various speeds available. For all speeds, the VCC2 voltage is 2.9V nominal and the VCC3 voltage is 3.3V nominal. 7.2 ELECTRICAL CONNECTIONS 7.2.1 Power/Ground Connections and Decoupling Testing and operating the GXm processor requires the use of standard high frequency techniques to reduce par- asitic effects. These effects can be minimized by filtering the DC power leads with low-inductance decoupling capacitors, using low-impedance wiring, and by utilizing all of the VCC2,VCC3, and VSS pins. 7.2.2 Power Sequencing the Core and I/O Voltages With two voltages connected to the GXm processor, it is important that the voltages come up in the correct order. VCC2 should come up at or before VCC3. There are no additional timing requirements related to this sequence. 7.2.3 NC-Designated Pins Pins designated NC (No Connection) should be left dis- connected. Connecting an NC pin to a pull-up/-down resistor, or an active signal could cause unexpected results and possible circuit malfunctions. 7.2.4 Pull-Up and Pull-Down Resistors Table 7-2 lists the input pins that are internally connected to a 20-kohm pull-up/-down resistor. When unused, these inputs do not require connection to an external pull-up/- down resistor. 7.2.5 Unused Input Pins All inputs not used by the system designer and not listed in Table 7-2 should be kept at either ground or VCC3.To prevent possible spurious operation, connect active-high inputs to ground through a 20-kohm (±10%) pull-down resistor and active-low inputs to VCC3 through a 20-kohm (±10%) pull-up resistor. Table 7-1. Part Numbers Core Frequency (MHz) Temperature (Degree C) Part Marking 266 70 GXm-266P 2.9V 70C 85 GXm-266P 2.9V 85C 70 GXm-266B 2.9V 70C 85 GXm-266B 2.9V 85C 233 70 GXm-233P 2.9V 70C 85 GXm-233P 2.9V 85C 70 GXm-233B 2.9V 70C 85 GXm-233B 2.9V 85C 200 70 GXm-200P 2.9V 70C 85 GXm-200P 2.9V 85C 70 GXm-200B 2.9V 70C 85 GXm-200B 2.9V 85C 180 70 GXm-180P 2.9V 70C 85 GXm-180P 2.9V 85C 70 GXm-180B 2.9V 70C 85 GXm-180B 2.9V 85C Note: B= BGAPackage P= SPGAPackage Table7-2. Pinswith 20-kohm Internal Resistor Signal Name BGA Ball No. SPGA Pin No. PU/PD SUSP#* H2 M4 Pull-up FRAME# A8 C13 Pull-up IRDY# C9 D14 Pull-up TRDY# B9 B14 Pull-up STOP# C11 A15 Pull-up LOCK# B11 B16 Pull-up DEVSEL# A9 E15 Pull-up PERR# A11 D16 Pull-up SERR# C12 A17 Pull-up REQ[2:0]# D3, H3, E3 E3, K2, E1 Pull-up TCLK J2 P4 Pull-up TMS H1 N3 Pull-up TDI D2 F4 Pull-up TEST F3 J5 Pull-down Note: *SUSP# is pulled up when not active. |
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