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GXM Datasheet(PDF) 200 Page - National Semiconductor (TI) |
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GXM Datasheet(HTML) 200 Page - National Semiconductor (TI) |
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200 / 244 page ![]() www.national.com 200 Revision 3.1 Package Specifications (Continued) Table 8-3. Mechanical Package Outline Legend Symbol Meaning A Distance from seating plane datum to highest point of body A1 Solder ball height A2 Laminate thickness (excluding heat spreader) aaa Coplanarity B Pin or solder ball diameter D Largest overall package outline dimension D1 Length from outer pin center to outer pin center D2 Heat spreader outline dimension E1 BGA: Solder ball pitch SPGA: Linear spacing between true pin position centerlines E2 Diagonal spacing between true pin position centerlines F Flatness L Distance from seating plane to tip of pin S1 Length from outer pin/ball center to edge of laminate |
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