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GXM Datasheet(PDF) 198 Page - National Semiconductor (TI) |
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GXM Datasheet(HTML) 198 Page - National Semiconductor (TI) |
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198 / 244 page ![]() www.national.com 198 Revision 3.1 Package Specifications (Continued) 8.2 MECHANICAL PACKAGE OUTLINES Dimensions for the BGA package are shown in Figure 8-2. Figure 8-3 shows the SPGA dimensions. Table 8-3 gives the legend for the symbols used in both package outlines. Figure 8-2. 352-Terminal BGA Mechanical Package Outline Sym Millimeters Inches MinMax MinMax A 1.45 2.23 0.057 0.088 A1 0.50 0.70 0.020 0.028 A2 0.43 0.83 0.017 0.033 aaa 0.20 0.008 B 0.60 0.90 0.024 0.035 D 34.80 35.20 1.370 1.386 D1 31.55 31.95 1.242 1.258 D2 32.80 35.20 1.291 1.386 E1 1.12 1.42 0.044 0.056 F 0.35 0.014 S1 1.42 1.82 0.056 0.072 F D2 A01 Index Chamfer 1.5mmonaside 45 Degree Angle CU Heat Spreader .889 REF. S1 D1 D D 1.5 1.5 E1 B A1 A2 A Seating Plane aaa Z Z |
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