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GXM Datasheet(PDF) 197 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # GXM
Description  Geode??GXm Processor Integrated x86 Solution with MMX Support
PDF  244 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

GXM Datasheet(HTML) 197 Page - National Semiconductor (TI)

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Revision 3.1
197
www.national.com
Package Specifications (Continued)
To choose the proper heatsink, the system designer must
make sure that the calculated
θ
CA falls above the curve
(shaded area). The curve itself defines the minimum tem-
perature rise above ambient that the heatsink can main-
tain.
See Figure 8-1 as an example of a particular heatsink
under consideration.
Figure 8-1. Heatsink Example
Example 1
Assume P (max) = 5W and TA (max) = 40°C.
Therefore:
In this case, the heatsink under consideration is more than
adequate since at 5W worst case, it can maintain a 40°C
case temperature rise above ambient (
θ
CA = 9) when a
maximum of 45°C (
θ
CA = 8) is required.
Example 2
Assume P (max) = 10W and TA (max) = 40°C.
Therefore:
In this case, the heatsink under consideration is NOT ade-
quate to maintain the 45°C case temperature rise above
ambient for a 9W processor.
For more information on thermal design considerations or
heatsink properties, refer to the Product Selection Guide of
any leading vendor of Thermal Engineering solutions.
0
10
20
30
40
50
24
68
10
θ
CA = 45/9 = 5
Heat Dissipated - Watts
θ
CA = 45/5 = 9
θ
CA
T
C
T
A
P
----------------------
=
θ
CA
85
40
()
5
----------------------
=
θ
CA
9
=
θ
CA
T
C
T
A
P
----------------------
=
θ
CA
85
40
()
9
----------------------
=
θ
CA
5
=



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