TPS61000, TPS61001, TPS61002, TPS61003, TPS61004, TPS61005, TPS61006, TPS61007

SINGLE- AND DUAL-CELL BOOST CONVERTER WITH START-UP INTO FULL LOAD

SLVS279C – MARCH 2000 – REVISED APRIL 2003

20

POST OFFICE BOX 655303

THERMAL INFORMATION

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

can be dissipated if the maximum ambient temperature of the application is lower.

mW

W

C

C

C

JA

R

A

MAX

J

T

MAX

D

P

136

/

294

85

125

)

(

)

(

=

°

°

–

°

=

Θ

=

(8)

–

Under normal operating conditions, the sum of all losses generated inside the converter IC is less than 50 mW,

which is well below the maximum allowed power dissipation of 136 mW as calculated in equation 8. Therefore,

power dissipation is given no special attention.

Table 4 shows where the losses inside the converter are generated.

Table 4. Losses Inside the Converter

LOSSES

AMOUNTS

Conduction losses in the switch

36 mW

Switching losses

8 mW

Gate drive losses

2.3 mW

Quiescent current losses

< 1 mW

TOTAL

< 50 mW