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XMC4100 Datasheet(PDF) 23 Page - Infineon Technologies AG |
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XMC4100 Datasheet(HTML) 23 Page - Infineon Technologies AG |
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23 / 94 page ![]() XMC4100 / XMC4200 XMC4000 Family General Device Information Data Sheet 23 V1.3, 2015-10 VSSO 41 - Power VSS Exp. Pad Exp. Pad Power Exposed Die Pad The exposed die pad is connected internally to VSS. For proper operation, it is mandatory to connect the exposed pad directly to the common ground on the board. For thermal aspects, please refer to the Data Sheet. Board layout examples are given in an application note. Table 11 Package Pin Mapping (cont’d) Function LQFP-64 TQFP-64 VQFN-48 Pad Type Notes Subject to Agreement on the Use of Product Information |
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