3

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example

HCPL-788J#XXX

No Option = 16-Lead, Surface Mt. package, 45 per tube.

500 = Tape and Reel Packaging Option, 850 per reel.

Option Data sheets available. Contact Hewlett-Packard sales representative, authorized distributor, or visit

our Web site at www.hp.com/go/isolator.

Package Outline Drawings

16-Lead Surface Mount

dimensions in inches

(millimeters)

Package Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Fig.

Notes

Input-Output Momentary

3750

Vrms

RH < 50%, t = 1

1,2,3

Withstand Voltage

Resistance (Input-Output)

Ω

3

Capacitance (Input-Output)

1.3

pF

f = 1 MHz

Input IC Junction-to-Case

θjci

120

°C/W T

Thermal Resistance

Output IC Junction-to-Case

θjco

100

Thermal Resistance

Note: Initial and continued

variation in the color of the

HCPL-788J’s white mold

compound is normal and does

not affect device performance

or reliability.

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)

Maximum Solder Reflow Temperature Profile

9

0.295 ± 0.010

(7.493 ± 0.254)

10

11

12

13

14

15

16

8

7

6

5

4

3

2

1

0.018

(0.457)

0.138 ± 0.005

(3.505 ± 0.127)

9°

0.406 ± 0.10

(10.312 ± 0.254)

0.408 ± 0.010

(10.160 ± 0.254)

0.025 MIN.

0.008 ± 0.003

(0.203 ± 0.076)

STANDOFF

0.345 ± 0.010

(8.986 ± 0.254)

0–8°

0.018

(0.457)

0.050

(1.270)

ALL LEADS

TO BE

COPLANAR

± 0.002

HP 788J

YYWW

TYPE NUMBER

DATE CODE